• Luyang 900c Nano Microporous Thermal Insulation Soft Board / Hard Board
  • Luyang 900c Nano Microporous Thermal Insulation Soft Board / Hard Board
  • Luyang 900c Nano Microporous Thermal Insulation Soft Board / Hard Board
  • Luyang 900c Nano Microporous Thermal Insulation Soft Board / Hard Board
  • Luyang 900c Nano Microporous Thermal Insulation Soft Board / Hard Board
  • Luyang 900c Nano Microporous Thermal Insulation Soft Board / Hard Board

Luyang 900c Nano Microporous Thermal Insulation Soft Board / Hard Board

Usage: Iron Voltage Electric Material, Thermal Insulation Coatings, Friction Material, Packing Material, Filter Material, High Temperature Insulating Material
Temprature Classification: 900
Chemical Composition:: Al2O3.SiO2
Shape: Board
Manufacturing Technique: Nano Microporous
Kind: Nano Microporous
Samples:
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Basic Info.

Model NO.
Luyang
Name
900c Nano Microporous Board
Product
900c Nano Microporous Thermal Insulation Boa
Manufacturer
Luyang
Raw Material
Nano Microporous Powder
Transport Package
Catton Box
Specification
1000 x 500 x (5-10)/10-50
Trademark
LUYANG
Origin
China
HS Code
68061010
Production Capacity
10000ton/Yea

Product Description

Luyang 900c Nano Microporous Thermal Insulation Soft Board / Hard Board

MICROPOROUS BOARD

Luyang Microporous Board is an efficient insulation product based on advanced microporous insulation technology. At low temperature, it has a lower thermal conductivity than still air. The thermal conductivity increases very little with the increase of temperature. At high temperature, its insulation effect is 3-4 times higher than traditional insulation materials. Luyang Microporous Hard Board has high compressive strength, covered with aluminum foil or glass fiber cloth. It is an excellent choice for the lightweight and energy-saving application of kiln.

 

Features

Excellent thermal shock resistance

Excellent thermal stability

Low thermal conductivity

Low heat storage

 

Typical Applications

Back-up insulation in high-temperature furnaces

Appliances insulation

Fire protection equipment

Electronic devices

 

Typical Parameters

Description

MICROPOROUS 60H
BOARD

MICROPOROUS 90H
BOARD

MICROPOROUS 105H
BOARD

Recommended Temperature of Use (ºC )

600

900

1050

Density (kg/m³)

300/320

280/300

320

Modules of Rupture (MPa)

≥0.15

≥0.15

≥0.15

Compressive Strength (MPa, 10% relative deformation)

≥0.3

≥0.3

≥0.3

Permanent Linear Shrinkage (%)

600ºC x 24h ≤2.0

900ºC x 24h ≤2.0

1050ºC x 24h ≤2.5

Thermal Conductivity (W/m·K)

100ºC

0.022

0.020

0.022

200ºC

0.024

0.023

0.024

300ºC

0.028

0.026

0.031

400ºC

0.029

0.027

0.036

500ºC

-

0.033

0.040

600ºC

-

-

0.048

Covering Material

Aluminum Foil / PE Foil / Glass Fiber Cloth

 

Standard Size (mm)

600 x 400 x (10-50)

1000 x 500 x (10-50)

Luyang 900c Nano Microporous Thermal Insulation Soft Board / Hard Board
  Luyang 900c Nano Microporous Thermal Insulation Soft Board / Hard Board Luyang 900c Nano Microporous Thermal Insulation Soft Board / Hard Board 
Luyang 900c Nano Microporous Thermal Insulation Soft Board / Hard Board

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