Thermal Insulation Microporous Hard Board

Product Details
Customization: Available
Usage: High Temperature Insulating Material
Temprature Classification: 1600℃, 1500℃, 1400℃, 1260℃, 1050℃
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Number of Employees
1985
Year of Establishment
1992-10-14
  • Thermal Insulation Microporous Hard Board
  • Thermal Insulation Microporous Hard Board
  • Thermal Insulation Microporous Hard Board
  • Thermal Insulation Microporous Hard Board
  • Thermal Insulation Microporous Hard Board
  • Thermal Insulation Microporous Hard Board
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  • Overview
  • Product Description
  • Product Parameters
Overview

Basic Info.

Model NO.
Luyang
Shape
Ceramic Fiber Blanket, Plate
Refractoriness (℃)
1580< Refractoriness< 1770
Feature
Long Time Materials, Instant Materials, Thermal Insulation Material
Type
Refractory Material
Material
Sio2
Name
Microporous Hard Board
Raw Material
Microporous Powder
Use
Thermal Insulation
Application
Back-up Insulation
Transport Package
Carton/Bag/Pallet
Specification
5~50mm
Trademark
Luyang
Origin
China
HS Code
68061010
Production Capacity
500, 000 Tons

Product Description

Thermal Insulation Microporous Hard Board
Product Description

Thermal Insulation Nano Microporous Board
Thermal Insulation Microporous Hard Board

Luyang Microporous Board is an efficient insulation product based on advanced microporous insulation technology. At low temperature, it has a lower thermal conductivity than still air. The thermal conductivity increases very little with the increase of temperature. At high temperature, its insulation effect is 3-4 times higher than traditional insulation materials. Luyang Microporous Hard Board has high compressive strength, covered with aluminum foil or glass fiber cloth. It is an excellent choice for the lightweight and energy-saving application of kiln.

 

Features

Excellent thermal shock resistance

Excellent thermal stability

Low thermal conductivity

Low heat storage

 

Typical Applications

Back-up insulation in high-temperature furnaces

Appliances insulation

Fire protection equipment

Electronic devices

 

Product Parameters

Typical Parameters

Description

MICROPOROUS 60H
BOARD

MICROPOROUS 90H
BOARD

MICROPOROUS 105H
BOARD

Recommended Temperature of Use (ºC )

600

900

1050

Density (kg/m³)

300/320

280/300

320

Modules of Rupture (MPa)

≥0.15

≥0.15

≥0.15

Compressive Strength (MPa, 10% relative deformation)

≥0.3

≥0.3

≥0.3

Permanent Linear Shrinkage (%)

600ºC x 24h ≤2.0

900ºC x 24h ≤2.0

1050ºC x 24h ≤2.5

Thermal Conductivity (W/m·K)

100ºC

0.022

0.020

0.022

200ºC

0.024

0.023

0.024

300ºC

0.028

0.026

0.031

400ºC

0.029

0.027

0.036

500ºC

-


0.033

0.040

600ºC

-

-

0.048

Covering Material

Aluminum Foil / PE Foil / Glass Fiber Cloth

 

Standard Size (mm)

600 x 400 x (10-50)

1000 x 500 x (10-50)

Thermal Insulation Microporous Hard BoardThermal Insulation Microporous Hard BoardThermal Insulation Microporous Hard BoardThermal Insulation Microporous Hard Board

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